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G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 1G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 2G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 3
  • G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 1
  • G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 2
  • G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 3

G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate

Model:FR4
Brand:Honglei FR4
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Circuit Board
Label:fiberglass , epoxy resin , heat proof insulatio
Price: US $1 / pc
Min. Order:500 pc
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Member Information

Detail

Product Description

Features:

(1)Low water absorption rate

(2)Hard to be deformed

(3)High mechanical strength,

(4)Good electric performance wether under the moist or dry environment, Flame retardant grade could reach 94-V0,

(5)High temperature resistant,high dielectric performance and mechanical processing performance.

 

Name: epoxy glass fiber sheet    
Model NO: FR-4    
Material: Glass fibre + epoxy resin    
Density: 2    
       
Item: Testing method Unit Result
Fire Retardancy Grade: A  -- 94-V0
Flame Resistance: C-96/20/65 °C 170-180
Voltage Resistance(penetrating) C-96/20/65 (in 25 °C oil) KV/mm 18
Voltage Resistance C-96/20/65 (in 25 °C oil) KV/mm 12
Arc Resistance C-96/20/65 S 60-80
Permittivity(1MHZ): C-96/20/65   -- 4.0-5.0
Permittivity(1MHZ): C-96/20/65 +D-48/50  -- 4.5-5.5
Volume anti-electric rate: C-96/20/65  +C-96/40/95 Ω-cm 5*10^11-10^13
Surface anti-electric rate: C-96/20/65 +C-96/40/90 Ω 5*10^11-10^12
Insulation Resistance: C-96/20/65 +D-2/100 Ω 10^12-10^13
Conmpressive Strength(Vertical): A kg/mm2 29-34
Conmpressive Strength(Horizontal): A kg/mm2 19-24
Anti-impact intensity(Parrallellable): A kg-cm/cm2  7-9
Bending strength(Horizontal): A kg/mm2 40-50
Clevability: A kg 850-1000
Adhesive strength: A kg 700-900
Compressive strength(Horizontal): A kg/mm2 20-24
Water absorption rate: E-24/50 +D-24/23 % 0.07-0.12

Application:

(1)Bottom plate of PCB punching and prototyping machine,

(2)Reinforcement plate of testing fixture,

(3)Needle plate

(4)The material of Flexible Printed Circuit Board

(5)Other electronical products

 

Stand Color: Aqua Green,Yellow

Standard size:1020*1220mm,1020mm *2040mm


Product Image

G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 1
Img 1
G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 2
Img 2
G10,G11,FR4,PCB,3240high density epoxy resin fiberglass insulation laminate 3
Img 3

Send Inquiry to this Member

Kunshanshi Honglei Electronics Technology Co.Ltd.

No.1 West Chengbei Road ,Kunshan City,Jiangsu Province,China

Phone:
86-512-87886693
Fax:
86-512-57730441
Contact:
Summer Guang (sales)
Mobile:
15962522906

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