PI Characteristic
1．Excellent mechanical properties
2.Both bigh temperature resistance and low temperature resistance
3.Great flame retardant
4.Great wear resistance
5.Great radiation resistance
6.Outstanding electric insulation
7.Chemical resistance
Application:
1.Parts and components with low friction coefficient and wear-resistance under high-speed and high pressure.
2.Parts and components with excellent anti-creep or plastic deformation
3.Parts and components with excellent self-lubricating and oily properties.
4.Fluid sealing parts under high temperature and high pressure.
5.Parts and components with high bending resistance,high tensile strength and high-impact performance.
6.Parts and components with corrosion-resistance,radiation-resistance,rust resistance.
7.Parts with continuous work temperature over 300℃ and short term temperature can up to 400-450℃.
8.High temperature(over 260℃)structural adhesive resistant(modified epoxy resin,modified phenolic resin,modified silicone adhesive does not exceed 260 ℃ .
9..Micro-electronics packaging, the protection coating of stress buffer,the internet layer insulate parts of multi-layer structure,dielectric films,the chip surface passivation and so on.
Main Performance Parameters:
Density:1.43 g/cubic centimeter
Water absorption:1.2%
Thermal deformation temperature:360 centigrade
Adaptive temperature:up to 450 centigrade
Oxygen Index:53%
UL rating:V-0
Breaking strength:86 MPa
Elongation at break:7.5%
Elastic modulus:2200 MPa
Charpy unnotched impact strength:not broken.
