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Detailed Product Description

Brief Introduction
1.full automatic high speed RFID inlay production system
2.flexibility,good quality
3.good stability

1. Product details

Smart Label Flip Chip Bonder is the full automatic high speed RFID inlay (both HF and UHF) production system. It provides an innovation in flip chip assembly technology for RFID inlay and covers over 10 worldwide advanced patents.

The system has the modularity feature of optimum flexibility and beneficiates of advanced technology in high speed RFID inlay manufacturing.

The system realize an assembly and test speed up to 10,000 inlays per hour under Golden Spring's patented technology leadership in RFID production solutions. It is easy of use and brings cost optimization to your production site.

It is adapted to a large variety of markets, such as Olympic game tickets, World EXPO tickets, Logistics, good management, manufacturing, access control, library, retail, airport baggage tags, transportation applications and product tracking applications.

 

2.Technical Parameters

Model	SLL-FRW3200-III
Speed	3200 UPH ±10%
Precision of robot	+/-0.003mm
Support materials	PET, Paper
Support frequency	HF, UHF
Chip size	0.3-12mm
Compatibe type	roll and sheet
Wafer Size	6 inch,8 inch,12 inch is can be customized

 

 

3. Applications

• Inlays (HF & UHF, all formats)
• Multirow or single row reels for label/ticket applications
• Tickets, logistic, goods management, retail, manufacturing, military, library, access control

 

4. Performance

 

(1) Modulare design

• Flexible: easy to select different modules to meet the different requirements
• Easy to update and upgrade: only add module to meet the changing requirements
• Easy to adjust, adjustment mechanisms available to each modules for convenience
• Stable, tight and easy connection between modules to make sure stability
• Better system structure design

(2) Faster speed with higher quality

(3) Highest flexibility for HF and UHF labels/tags and tickets

(4) Process of all types of chips and antennas

(5) Best product quality, stability and market reputation

(6) Highest yield

(7) Perfect manufacturing and personalization process

(8) Perfect web formats for contactless card production

(9) Patented technology with smallest glue consumption and best flexibility

(10) Upgradeable for manufacturing of labels and cards

(11) Advanced robotic and vision technology with flexibility

(12) Best quality components

(13) Fastest speed for switching for different products

(14) Patented technology to produce high quality samples

(15) RFID turnkey solution providing

(16) Self-developed technology and knowhow