Home > Products > Industrial Supplies > Other Industrial Supplies

Allwin21 Corp. is a leading supplier of sputter deposition equipment for high technology applications for Semiconductor III-V, II-VI, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. The AccuSputter AW4450 is designed for flexibility offering a wide range of operating and process modes. The highest quality construction, components and Allwin21's new real time AW-4450 System Control assure reliable operation and an ultra clean vacuum environment to yield consistently reproducible results. Every AccuSputter AW 4450 sputtering system is supported by years of technological experience and backed by a worldwide sales and service organization dedicated to prompt courteous service

AccuSputter AW4450Proven Sputter Materials:

Al+W ,Cr/SiO2, SiC ,Ti+Au,InSnO ,SiO2 ,Ti/W ,Ti+Au+Ni,Al2O3 ,Mo ,SiO2+O2 ,Ni/Fe+Cu+SiO2,Ag MoSi2 ,Si+N2(Si3N4) ,Ti/W+Au,Au ,Mo2Si5 ,Si+N2+B4C, Ti/W+Au+Ta, C, Mo5Si3 ,Ta ,Ti/W+Al/Si,Cr Ni ,TaC, Ti/W+Ni/Cr+Au,Cr/Co ,Ni/Cr, Ta+Au , Ti/W+Pt,Cr/Au, Ni+Ni/Cr, TaSi2 ,Al+Ti/W+Ag, Cr+Cu, Ni/Fe ,Ta+SiO2 , W+Al2O3,Cr/Si ,Pt, Zr ,Zn,Cr/SiO, TiO2 ,TiO2+Cr, ZnO2

AccuSputter AW4450Sputter Key Features:

• Production-proven sputter technology
• Optimum AW-4450 System Control
• DC 24V for Motors, Actuator, Relay, Solenoid
• Efficient 8" Delta cathodes, 2 to 6" option
• Full Pallet rotation control with “indexing”
• High Uniformity and Yield
• DC, RF Sputter, Pulse DC option
• Magnetron and Diode Sputter option
• RF Etch and Bias are optional
• Ultra Clean vacuum system
• Load lock operation
• UHV design
• Flexible for development or production use
• Full range of substrate sizes and shapes
• Various pumping and power options
• Co-sputtering option
• Reactive Sputtering option
• Made in U.S.A.

AccuSputter AW4450Sputter Software Key Features:

• Maintenance, Manual, Semi Automatic and Fully Automatic modes.
• Automated calibration of all subsystems.
• Troubleshooting to subassembly levels.
• Programmed comprehensive calibration and diagnostic functions.
• Recipe creation for full automatic wafer processing.
• Automatic decline of improper recipes and process data inputs.
• Multi-level password protection.
• Storage of multiple recipes and system functions.
• Real-Time process graphics, data acquisition display, and analysis.
• Process Data and Recipe storage automatically to hard drive.
• Easy TC vacuum gauge calibration.
• Positioning Deposition (optional)
• GEM/SECS II (optional)

AccuSputter AW 4450 Configuration:

• Main Frame
• 28" dia. SST chamber top plate with ports for 8-inch(4) circle or Delta (3) Cathodes
• Sputter Power Supply,DC or RF or Pulse DC power, RF: 1-3KW; DC: 5KW or 10KW
• Process Chamber

8" diameter X 12" high stainless steel cylinder with 6"

CF flange viewport and load lock port

28" diameter stainless steel base plate

11/2" air-operated roughing isolation valve

Air-operated gas inlet valve

Air-operated vent valve

11/2"blanked-off leak check port

Removable deposition shields

23" diameter, 3-position water-cooled annular substrate table with variable-speed motorized table drive

Full circle shutter and vane shutter

Chain drive pallet carrier transport

Heavy duty electric hoist

• Load lock

30" x 28" x 8" stainless steel load lock chamber with aluminum cover

Chain drive pallet carrier transport

2" air-operated roughing isolation valve

Air-operated vent valve

23" diameter molybdenum annular substrate pallet

Elevator for pallet up and down function.

• Vacuum Systems for process Chamber

2 stage Cryo pump with 1000 l/s pumping speed for air, including chevron, water-cooled compressor and lines, automatic regeneration controller and plumbing kit. 71/2" O.D. (6" ASA) aluminum air-operated gate valve Air-operated venetian blind throttling valve.

36.7 cfm mechanical pump or dry pump for process chamber and load lock (Optional)

• 1 gas line with MFC(Ar, 200 SCCM or Customized)
• New Controller: Allwin21 Corp.'s AW-4450 System PC Control
• New Power Distribution Box: AC380V /208V/ 3Phase

AccuSputter AW4450Sputter Options:

• GEM/SECS II function (Software)
• More gas lines with MFC(① N2; ② O2; ③ Customized)
• Lamp tower alarm with buzzer.
• Mechanical pump or dry pump for process chamber and load lock.
• Independent mechanical pump or dry pump for process chamber.
• Chiller for Cooling plates and table.
• Turbo pump for load lock.
• Load lock Lamp Heating function, Up to 200°C
• Chamber Lamp Heating function, Up to 300°C (Use one cathode port in SST chamber top plate).
• Plasma etch function (before sputter)
• Bias function
• Co-sputter function
• Reactive sputter function
• Transformer for AC 380V to 208V for DC Power Supply (if necessary).

Keywords:Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition