Product Description
Japan SHINETSU believe the X - 23-7783 d, the thermal silicone grease is Japan the letter by nanometer material made of nano silicon grease, according to the demand of the market application of new nano thermal technology, in thermal conductive silicone grease added nano thermal conductive materials, making thermal silicone grease can capitally fill the gaps between the radiator and IC, achieve the best cooling effect, the letter and 2 X - 23-7762, G751, also is the thermal silicone grease using nanotechnology products.
Electronic industry in general high-performance field, design will consider using the letter thermal silicone grease (gold paste) : X - 23-7783 d.
The letter X - 23-7783 d thermal silicone grease belongs to nanotechnology thermal silicone grease, add the high-performance metal to human material, heat conduction performance good, focus on the high thermal conductivity and operability, and add about 2% of isoalkane. The most suitable as CPU, MPU TIM - 1 the cooling material.
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