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This type of blade is mainly used for cutting off and grooving of polycrystalline and monocrystalline silicon: chips, solar cells, etc. It not only reduces the material consumption, but also improves the performance and economic benefit. It's the ideal processing tool of silicon material.

Metal bond diamond saw blade is fast cutting with minimum chipping, high precision, long working life, etc.

Application

Polycrystalline and monocrystalline silicon:chips,solar cells, etc.

 

Diameter		Ring Width	Thickness	Bore Diameter
Inch	mm	(mm)	(mm)	(mm)
7〞	180	1.8	10	22/60
8〞	200	1.8	10	25.4/32
10〞	250	2.0/2.2	10	25.4/60
12〞	300	2.2/2.4	10	25.4/60
14〞	350	2.8/3.0	10	25.4/50
16〞	400	3.0/3.2	10	20/25.4/75
18〞	450	3.2	10	20/25.4/75