| Model: | H-051 |
|---|---|
| Brand: | HSF |
| Origin: | Made In China |
| Category: | Electronics & Electricity / Electronic Components / Circuit Board |
| Label: | bare pcb , printed circuit boar , pcb/pcba assembly |
| Price: |
¥0.15
/ pc
|
| Min. Order: | 100 pc |
| Live Chat: | Last Online:29 May, 2012 |
PCB board for electronic products
1layers:2
2.Material: FR-4
3.Copper thickness: 1OZ
4.Board thickness: 1.0mm
5.Finish:lead free HASL
6.Solder mask color: green,blue,red ect.
7.Lengend color:white, black,green
8. Min Diameter of Drilling Hole:0.25mm
9.Min Diameter of Punched Hole:0.9mm
10.Tolerance
- Experienced Technical Staff
- Competitive Price
- Product Features
- Customized Service
- Small Order Accepted
- Quality Approval
- RoHS compliant
Manufacturing capability
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Item |
Capalitily |
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1.Layer |
1-18 |
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2.Basic Material |
CEM-3,FR-4,CEM-1 |
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3.Board Thickness |
0.2mm-3.2mm (8mil-126mil) |
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4.Min Thickness of Core Board |
0.1mm(4mil) |
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5.Copper Thickness |
Min:1/3 oz ; Max:3 oz |
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6.Min Trace Width/Space |
0.075mm(3mil) |
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7.Min Diameter of Drilling Hole |
0.25mm(10mil) |
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8.Min Diameter of Punched Hole |
0.9mm(35mil) |
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9.Tolerance |
Position of Drilled Hole |
±0.075mm(3mil |
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Trace Width |
±0.05mm(2mil) |
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Aperture |
PTH±0.075mm(3mil)
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Outline Tolerance |
Drilling: ±0.13mm(6mil) |
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Warpage |
>0.7 |
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10.Surface Treatment |
Gold,Plating/Immersion Gold/HAL/HAL lead-free/Immersion Silver/Entek |
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1I.nsulation Resistance |
10KΩ-20MΩ |
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12.Conduction Resistance |
< 50Ω |
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13.Testing Voltage |
300V |
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14.V-CUT |
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Min:110×100mm Max:660×600mm |
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Board Thickness |
Min:0.6mm(24mil) |
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Reserved Thickness |
Min:0.3mm(12mil) |
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Tolerance |
±0.1mm(4mil) |
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Slot Width |
Max:0.50mm(20mil) |
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Slot to Slot |
Min:10mm |
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Slot to Trace |
Min:0.50mm(20mil) |
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15.Slot |
Slot size:tol.>=2W(tolerance) |
PTH L:±0.15mm(6mil) W:±0.1mm(4mil) |
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NPTH L:±0.125mm(5mil)
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16.Min Hole Pad |
PTH :0.13mm(5mil) |
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NPTH :0.18(7mil) |
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17.Multilayer Board |
Psition of hole |
0.075mm(3mil) |
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Deviation between Layers |
4 layers: Max 0.15mm(6mil) |
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6 layers: Max 0.025mm(6mil) |
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Min insulation hole pad in inner layer |
0.025mm(10mil) |
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Min Distance from Board Edge to Inner Roundess |
0.25mm(10mil) |
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Board Thickness |
6 layers:±0.15mm(6mil) |
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