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BGA rework station reball solder repair laptop mobile phone ps xbox ZX-C2 1
  • BGA rework station reball solder repair laptop mobile phone ps xbox ZX-C2 1

BGA rework station reball solder repair laptop mobile phone ps xbox ZX-C2

Origin:Made In China
Category:Electronics & Electricity / Other Electrical & Electronic
Label:BGA , rework , reball
Price: US $1 / pc
Min. Order:1 pc
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Member Information


Shenzhen Zhenxun Technology Co., Ltd

Free MemberGuang Dong - China
Live Chat:Last Online:25 Apr, 2013

Product Description

1.Using three independent temperature control, more accurate;
2.Upper and bottom heater using good material, can accurately regulate hot air flow and temperature , high temperature generated breeze, third with far infrared heating plate to preheat.
3.The first, second and third-zone with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve;
4.First zone and second start running temperature curve at the same time, third zone start running temperature rise and drop at the same time with first and second zone;
5.The first-, second-zone with over temperature protection design;
6.After remove and welding, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of welding;
7.The first temperature zone can be front and back, up and down adjustment and 360-degree rotation, convenient to operate;
8.The second temperature can adjust according to different PCB board appearance and components, prevent collision with  PCB lower plate components;
9.The third zone can be moved right and left, suitable to repair  large BGA,CBGA and BGA in partial side of PCB board;
10.Equipped with a variety size of hot-air nozzle, or made according to special requirements, free rotation of hot air nozzles;
11.Adjustable PCB jaw, to prevent collision with the components;
12.Adjustable high-temperature resistance bracket, position rack designed to protect against hot;
13.After BGA remove and welding  have voice alarm function;
14.Hand-held vacuum suction pen take BGA, convenient reliable and durable ;

PCB Size Max L330*W320mm
PCB Thickness 0.1~5mm
Temperature Control K thermocouple  PID Closed loop
PCB Positioning mode Outer
Bottom preheat Infrared  2400W
Main (Top+bottom) heater Hot air  800W+800W
Power supply Single phase  220V,50/60Hz,4.0KVA
Dimension L550*W530*H550mm
Weight Approx. 50kgs

Product Image

BGA rework station reball solder repair laptop mobile phone ps xbox ZX-C2 1
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Shenzhen Zhenxun Technology Co., Ltd

No.A Building, Wanxin Plaza,Shajin town,Bao'an Dist, Shenzhen, China

Jack Du (oversea manager)

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