Product Description
Key Specifications/Special Features:
Specifications:
Base materials: high-temperature FR4/FR5, free halogen FR4, aluminum based, polyimide, Rogers, Arlon, Other Teflon/PTFE
Layers: 1 to 20 layers standard PCB, blind vias and buried vias board
Minimum track space: 4/4, 3mils partial allowed
Maximum size: 1,000 x 1,200mm
Minimum size: 3 x 3mm
Surface copper thickness:
Maximum: 6/6oz
Minimum: 0.5/0.5oz
Maximum board thickness: 6.0mm
Finishes: SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin, electroless nickel/immersion gold
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