Model: | KY805A Series |
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Brand: | - |
Origin: | Made In China |
Category: | Chemicals / Adhesives & Sealants |
Label: | Solder Paste , Lead free paste , solder scream |
Price: |
-
|
Min. Order: | 20 pc |
Product Detail:
KY805A series lead free solder cream is a no-clean solder paste which use in SMT production processing. It is designed with the compound of low oxide contained spherical alloy solder powder and special solder paste and has good printability. Moreover, in order to reach the excellent insulation and residual resistance and make sure the reliability of the “no-clean” efficiency after back welding our product is specially designed with the high reliability low ionic
activator system.In order to match different production processing requirement we could adjust the quantity of the alloy, powder and other metallic materials.
Specification:
Testing standard and methods:ANSI/J-STD-004/005/006;SZ3197-86;ISZ 3283-86;PC-TM-650
Composition Analysis
Item |
Composition |
Value |
1 |
Tin( Sn)% |
99±0.5 |
2 |
Silver(A g)% |
0.3±0.05 |
3 |
Copper(Cu)% |
0.7±0.02 |
4 |
Lead(Pb)% |
≤0.10 |
5 |
Stibium(Sb)% |
≤0.02 |
6 |
Bismuth(Bi)% |
≤0.10 |
7 |
Steal(Fe)% |
≤0.02 |
8 |
Arsenic(As)% |
≤0.03 |
9 |
Zinc(Zn)% |
≤0.002 |
10 |
Aluminum(Al)% |
≤0.002 |
11 |
Cadmium (Cd) % |
≤0.002 |
12 |
Nickel((Ni)% |
≤0.005 |
Notes: All the above metallic material quantity of the alloy solder powder could be check in quality inspection
|
Tin particle size distribution and Alloy physical properties
|
Diameter(UM) |
Application Distance |
Melting Point 217~218℃ |
|
2# |
45~75 |
≥0.65mm(25mil) |
Alloy Specific Gavity |
7.4g/cm3 |
2.5# |
25~63 |
≥0.65mm(25mil) |
Hardness |
15HB |
3# |
25~45 |
≥0. 5mm(20mil) |
Thermal Conductivity |
64J/M.S.K |
4# |
20~38 |
≥0.4mm(16mil) |
Tensile Strength |
52Mpa |
5# |
15~38 |
≥0.4mm(16mil) |
Elongation |
27% |
6# |
10~30 |
Micro BGA |
Conductivity |
14%of IACS |
Payment Terms: | TT |
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