Product Description
- Layer: 8
- Material: FR4 (high Tg)
- Copper thickness: 1oz
- Min line width: 6mil
- Min line space: 6mil
- Min hole size: 0.3mm
- Surface treatment: ENIG
- Finished board thickness: 1.6mm
- Solder mask: gloss green
- Blind, buried holes and impedance based on the design
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