Product Description
Product Description
Layer: 6-layer Material: FR4 tg135+/-5 Board thickness: 1.6mm +/-10% Final copper: 1~1oz Min. Hole size: 0.25mm, Blind VIA, L1~L2, L5~L6 Min. Trace width: 0.1mm Min. Trace space: 0.1mm Surface finish: Immersion Tin Profile:
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