Leadsintec Technology Co., LtdSally (sales) |
Member Description![]() Strong OEM manufacturing capabilities and engineering support Our manufacturing facilities include clean workshops and advanced high-speed SMT lines. Our chip placement precision can reach +0.1MM on integrated circuit parts. It means we can deal with almost all kinds of integrated circuits, such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA. Additionally, we can provide 0201 chip placement, through-hole component insertion and finished product fabrication, test and packing. Our capability and service range 1. Production of customer designed components 2. SMD assembly and through hole component insertion 3. IC pre-programming 4. Function verification and burn in testing 5. Complete unit assembly (including plastic, metal box, coil, cable inside and others) 6. Environmentally friendly coating 7. the end of life component planning, obsolete component replacement and design support for circuit, metal and plastic enclosure. 8. Packing design Commitment to improve product quality We are committed to improving our product quality constantly. Our company is ISO9001:2000 certified and our products shall be fully checked before delivery. Striving for 100% customer New ProductMember Info
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