Product Description
- Base material: FR-4
- Copper thickness: 1oz
- Board thickness: 1.6mm
- Hole size: 0.4mm (minimum)
- Line width: 0.15mm (minimum)
- Line spacing: 0.15mm (minimum)
- Surface finishing: gold plating
- S/M pitch: 0.075mm/3mils (minimum)
- Whole size: 0.1mm/4mils (minimum)
- Blind and buried via: 0.15mm/6mils (minimum)
- Materials: FR1, FR4, H-TG, teflon, rogers
- Ceramics, aluminum and copper base
- Prototype orders are welcomed
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