| Model: | xingda03 |
|---|---|
| Brand: | - |
| Origin: | Made In China |
| Category: | Electronics & Electricity / Electronic Components / Circuit Board |
| Label: | PCB , FR4 , multi layer |
| Price: |
US $0.1
/ pc
|
| Min. Order: | 1 pc |
| Live Chat: | Last Online:31 Jan, 2013 |
|
HDI
|
||
|
Mass Production
|
Prototype
|
|
|
HDI structure
|
1+N+1,1+1+N+1+1
|
2+N+2
|
|
Buried hole
|
Filled
|
Filled
|
|
Aspect ratio
|
0.75:1
|
0.75:1
|
|
Minimum laser hole
|
0.1mm(4mil)
|
0.1mm(4mil)
|
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Minimum laser pad
|
0.25mm(10mil)
|
0.25mm(10mil)
|
|
Blind hole
|
No filled
|
No filled
|
|
Rigid & Flex board
|
NO
|
YES
|
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Press fit hole
|
YES
|
YES
|
|
Control Depth drilling
|
YES
|
YES
|
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Lead-free &Halogen-free
|
YES
|
YES
|
|
Immersion Gold
|
Ni:2-5µm Au:0.05-0.10µm
|
Ni:3-6µm Au:0.075-0.15µm
|
|
Immersion Tin
|
0.6-1.2µm
|
0.6-1.2µm
|
|
Immersion silver
|
0.2-0.6µm
|
0.3-0.6µm
|
|
OSP
|
0.1-0.4µm
|
0.25-0.4µm
|
|
HASL (Sn-Pb&LF)
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Pad:>3µm /Big Cu:>1µm
|
Pad:>4µm Big Cu:>1.5µm
|
|
Flash Gold
|
Ni:3-6µm Au:0.01-0.05µm
|
Ni:3-6µm Au:0.02-0.075µm
|
