Model: | HC240 |
---|---|
Brand: | KY |
Origin: | Made In China |
Category: | Electronics & Electricity / Insulation Material |
Label: | thermal pad , Thermal silicon pad , thermal interface |
Price: |
¥4
/ pc
|
Min. Order: | 10 pc |
Live Chat: | Last Online:15 Mar, 2013 |
HC thermal conductive interface pad
Features & benefits:
-High reliability & High thermal conductivity
-High compressibility, soft and flexible
-Natural stickiness, no extra surface frontal adhesives
-Meet with the environmental requirements of ROHS and UL
Typical applications:
-Communication equipment -Mobile equipment
-LED Light -Video equipment
-Switching power supply -Networking equipment
-Back light model -Household appliances
-Medical equipment -PC server/workstations
Application modes
-The filling between PCB and heat sink
-The filling between IC and heat sink or product outer coving
-The filling between IC and similar heatsink cooling materials
Physical properties:
Test item |
Test method |
Unit |
HC240 Test Value |
HC-PAD Test Value |
Color |
Visual |
Grey/Black |
Grey/Black |
|
Thickness |
ASTM D374 |
Mm |
0.5 to13.0 |
1.0 to 13.0 |
Specific Gravity |
ASTM D792 |
g/cc |
1.8±0.1 |
1.8±0.1 |
Hardness |
ASTM D2240 |
Shore C |
18±5 to 40±5 |
10±5 |
Tensile Strength |
ASTM D412 |
kg/cm2 |
8 |
8 |
ASTM D412 |
Pa |
5.88*10 9 |
5.88*10 9 |
|
Continuous Use Temp |
EN344 |
℃ |
-40 to +220 |
-40 to +220 |
Volume Resistivity |
ASTM D257 |
Ω-CM |
1.0*1011 |
1.0*1011 |
Breakdown Voltage |
ASTM D149 |
KV/mm |
4 |
4 |
Flame Rating |
UL-94 |
V-0 |
V-0 |
|
Conductivity |
ASTM D5470 |
w/m-k |
2.4 |
2.4 |
Configuration available: 200mm*400mm, 300mm*300mm, specific size could be provided
according to your requirements.
Enhanced product: HCPAD thermal conductive mud, mainly for the thermal conductivity
on the PCB r ed electronic components .