The new generation of Laser Scribing Machine is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system.

Technical Parameters of Laser Scribing Machine:
Wavelength: 1064 nm
Pump source: Diode Laser
Modulated frequency: 0.5 - 50 kHz
Beam power: Adjustable, max 50 W
Scribing speed: Adjustable, max 120 mm/ s
Max scribing depth: 1.2 mm
Min scribing line width: 0.05 mm
Scribing area: 100/ 200/ 300mm × 100/ 200/ 300 mm, optional
CNC worktable accuracy: 0.01 mm
Power supply: 1-phase 220 VAC +/- 10%, 50 Hz (A voltage stabilizer might
be required to avoid irregular scribing quality caused by severe voltage fluctuation).
Input power: Max 2 kW

Advantage:
Excellent beam quality and system reliability
High-speed scribing (up to 120 mm/s), very low-defective index,
Auto cooling system
Precise CNC worktable
Friendly man-machine interface and simple software operation system