Hot plate to thermally cure the thin films and coatings
Product Description
CHEMAT TECHNOLOGY, INC. Has designed and manufactured a compact and easy-to-use hotplate, Model KW-4AH, for baking and curing thin films and coatings. Its r ed, portable design, and temperature uniformity make it a versatile tool for research facilities. In conjunction with KW-4A spin coater, KW-4AH hotplate can be used to fabricate metal oxide thin films, polymer coatings and metal organic thin films.
Operation: Manual Load
Process Control: Program (For details see OMRAN operation manual)
Temperature fluctuation: ≤ ± 1°C
Temperature uniformity: ≤ ± 3%
Temperature Range:
—30°C - 350°C (KW-4AH-350)
—30°C - 600°C (KW-4AH-600)
Substrate Size:
—7.5 inch X 7.5 inch(KW-4AH-350)
—5.8 inch X 5.8 inch(KW-4AH-600)
Inert gas purge (KW-4AH-600 only)
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