Product Description
As a new and high capability substrate, DBC substrates have been used widely in electric power and electronic industry. The high thermal conductivity of Al2O3 (24W/mK) and AIN(180W/mK) combined with the high thermal capability of thick high purity copper(typically 0.2mm or 0.3mm thick copper) make DBC the most popular material choice for power chip on board assemblies.
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