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Direct Copper Bonded/DBCu Substrates 1Direct Copper Bonded/DBCu Substrates 2
  • Direct Copper Bonded/DBCu Substrates 1
  • Direct Copper Bonded/DBCu Substrates 2

Direct Copper Bonded/DBCu Substrates

Model:DBC
Brand:ELE
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Other Electronic Components
Label:Power Semiconductor , Power Hybrids , Solar Cell Board
Price: -
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Member Information

Detail

ELE Advanced Ceramics Inc

Free MemberFu Jian - China
Live Chat:Last Online:29 Mar, 2012

Product Description

Direct Copper Bonded/DBCu Substrates 
Excellent electrical insulation 
Very good thermal conductivity 
Superb thermal cycling 

 
Direct Copper Bonded/DBCu Substrates
Features                         

·Fine Mechanical strength            

·Fine Adhesion and Corrosion Resistent

·Excellent Electrical Insulation and Thermal Conductive Properties   

·High Reliability                    

·Lower Thermal Expansion Coefficient 

·Etchable to Various Graphs          

 

Applications

 Power Semiconductor Modules

·Power Hybrids

·Power Control Circuits

·Solid-state Relays

·Semiconductor Refrigerators

·Electronic Devices for Automobile

·Intelligent Power Assemblies

·Solar Cell Board




Product Image

Direct Copper Bonded/DBCu Substrates 1
Img 1
Direct Copper Bonded/DBCu Substrates 2
Img 2

Send Inquiry to this Member

ELE Advanced Ceramics Inc

Rm2302 Dihao Building, No.820 Xiahe Road

Phone:
86-592-2960185
Fax:
86-592-2960178
Contact:
YuliaChen (Manager)
Mobile:
2960185
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