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YZS-500 automatic wafer packaging line is researched and developed by our company, which is considered to be the most advanced wafer packaging line currently.  The line includes belt conveyor, automatic grouping device, automatic arranging device and automatic feeding device; it also can be connected with the production line and eliminate artificial feeding, which can greatly save labor cost and increase production efficiency. By the unique feature on both single and multi-chip wafer packaging, this line will significantly save cost for enterprise.