Model: | HBC-2830 |
---|---|
Brand: | Pankie |
Origin: | Made In China |
Category: | Construction & Decoration / Building Sealing |
Label: | epoxy adhesive , epoxy sealant , sealant |
Price: |
-
|
Min. Order: | 1000 pc |
Live Chat: | Last Online:19 Nov, 2010 |
Item
|
usage
|
performance
|
2830 Typical
|
Used in the potting sealing for the general electronic components and protecting sealing for the circuit boards At room temperature.
|
In the normal atmospheric temperature it can be solidified, and when solidifying, the exthothermal temperature is low. the shrinking rate is low. the solidified surface is bright, no cracking, moisture-proof, water-resistant insulation, no corrosion-resistant chemicals.
|
item
|
2830
|
proportion of mixture(weight ratio)
|
10:2.5 That is 4:1
|
Using time
(100g,hr ,25 C)
|
1
|
Solidified condition
|
Under 25 ℃, within
6 to 8 hours will start to solid, fully cured within 24 to 48 hours |
Testing item
|
2830
|
||
Fore solidifying
|
appearance
visual estimation
|
liquid cement A
|
Black viscous fluid
|
Glue B
|
Brown viscous fluid
|
||
densityg/cm3
(25℃)
|
Glue A
|
2.01~2.05
|
|
Glue B
|
1.10~1.13
|
||
Viscosity cps
(25℃)
|
adhesive solution A
|
15000~
35000
|
|
adhesive solution B
|
40~120
|
||
Aft solidifying
|
hardness(Shore-D)
|
>80
|
|
Volume Resistance (Ω.cm 25℃)
|
2.8×1015
|
||
breakdown voltage (kV/mm 25℃)
|
>30
|
||
dielectric constant (1.2MHz 25℃)
|
3.1±0.1
|
||
dielectric dissipation factor (1.2MHz, 25℃)
|
<0.01
|
||
Dimensional shrinkage constraint(%)
|
<0.4
|
||
shear strength(Fe-Fe,MPa)
|
>10
|
||
Temperature (℃)
|
-60~+90
|
||
thermal conductivity
[W/(m·k),25℃]
|
0.6
|