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Thermal Conductive Soft Pads are specially designed for the purpose of high performance thermally conductivity to solve some of most difficult thermal problems. The material is used to conform to the irregular surface under moderate application pressures. The products are widely applied in electronic parts such as IC, CPU, LED, laptops, PC, DVD application and so on. It has been also used in memory modules, heat pipe assemblies, voltage regulators and automotive electronics. Fiberglass carrier can be added for improved mechanical strength and also provides an adhesive for improved application performance.

 Features: 

• High electrical strength.
• Excellent mechanical strength and puncture resistance. 
• High Temperature endurance with UL recognized flammability rating. 
• Available with and without acrylic PSA (specific adhesive are upon request). 
• Customized die-cut service available upon customers’ requests.
• Meet RoHS specification. 

Specification: 300mm x 300mm

Thickness: 0.5~18mm.

Color: White, Gray, Black, Pink, Brown, other color on request.