Home > Products > Chemicals > Adhesives & Sealants

Technical data
Low temperaturehot melt glue stick/powder
Procedure：It can be used for glue gun，hot melt glue machine, can be stciked on plywoods、paper products、fibers、leathers、metals,plastics,special for export and low temperature area ，low temerature area uses this products, ，good bonding，not easy seperate，not break, belongs to high level products.

Main component: poly resin
Chill-proof：－１８℃－２５℃
Solid component: 100%
Softness point： ７5℃±5℃
Brookfield Vocosity 180℃……………………12500±1500mpas
Spec: Dim: (big)11.3±0.3Χ250mm 　Dim (small) 7.5 ±0.3 Χ250mm 　 Special Dim.: 1５±0.3Χ300mm 　
The time of solidification: 10-13sec
outer view: transparent stick/powder
Character： non-toxic、meet enviroment requirement。middle hardness，good strengthen，middle vicosity，high bonding，easy operation。
Specification: 　s est to use 60-80W hot melt glue gun or machine
Storage: storage at cool area、ventile and dry area，can be storaged 12 months。
packing： carton

Caution：during on working ，do not put the gun at flat 。

above data referece only, ，we s est user to do the test in order to make sure the final data.