Product Description
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias.
2). FR-4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over nickel
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