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BERGQUIST HI-FLOW THF 3000UT  Features and Benefits

• Thermal impedance: 0.05°C-in.2/W

(at 25 psi)

• High thermal conductivity: 3.0 W/mk

• Phase change softening temperature

52°C

• Naturally tacky

• Tabulated for ease of assembly

BERGQUIST HI-FLOW THF 3000UT is  a naturally tacky, thermally conductive phase change 

material which is supplied in an easy to use tabulated pad form. In the application the material 

undergoes a phase change softening, starting near 52°C. The phase change softening feature

improves handling characteristics prior to a facilitated assembly. At application temperatures and

pressures, BERGQUIST   HI-FLOW 565UT wets out the thermal interfaces producing a very 

low  thermal impedance.

BERGQUIST   HI-FLOW 565UT  Typical Applications Include:

• Processor lid to heat sink

• Processor die to lid or heat sink

• FBDIMM to heat spreader

Configurations Available:

• Tabulated in roll form, kiss-cut parts – no holes

• BERGQUIST HF565UT is limited to a square or rectangular part design.

Dimensional tolerance is +/- 0.020 in. (0.5 mm)