Thermal Silicon Pad Heat Transfer for CPU/GPU Heat Sink
Product Description
Thermal Silicon Pad Heat Transfer for CPU/GPU Heat Sink
Description of Thermal Pad
1.The product has high thermal conductivity. Under the relative pressure, it can achieve low interface thermal resistance. With application of power devices and cooling aluminum or machine shell, you can effectively remove the air to achieve a good filling effect.
2.The thermal pad has good insulation pressure and temperature stability, safe and reliable.
3.The product has good softness and resilience.
Elements of Thermal Pad
Ceramic thermal powder; Silicone elastomers
| Thermal Pad |
| Property |
ASTM |
Unit |
TS100 |
TS150 |
TS200 |
TS300 |
| Color |
Visual |
/ |
Grey |
Grey |
Grey |
Grey |
| Thickness |
D374 |
(mm) |
0.5-8 |
0.5-8 |
0.5-8 |
0.5-8 |
| Specific Gravity |
D792 |
g/cc |
2.4 |
2.1 |
2.5 |
2.6 |
| Hardness |
D2240 |
Shore 00 |
35 |
30 |
30 |
30 |
| Breakdown Voltage |
D149 |
(KV) @1mm |
>6 |
>6 |
>6 |
>6 |
| Volume Resistivity |
D257 |
Ω-cm |
9.6*1012 |
9.6*1012 |
9.6*1012 |
9.6*1012 |
| Flame Rating |
UL94 |
/ |
v-0 |
v-0 |
v-0 |
v-0 |
| Thermal Impedance |
Thermal Conductivity |
°C-in2/W |
1.08 |
1.1 |
0.96 |
0.8 |
| Thermal Conductivity |
D5470 |
W/m.k |
1.0 |
1.5 |
2.0 |
3.0 |
Features and Advantages of Thermal Pad
1.High thermal conductivity, low thermal resistance;
2.Excellent insulation performance;
3.Good surface wetting;
4.Good resilience, reliable long-term duration
Production Environment of Thermal Pad
Our company is committed to becoming a leading thermal management and electromagnetic shielding material solution company that can challenge the international giants through independent research and development materials and its application technology. The control of harmful substances is in line with the EU ROHS / ROHS control standards.
Packing Specifications of Thermal Pad
Size: length 400mm*200mm (0.5≤T≤5.0mm), according to customers' requirements
Health and Safety
Shelf life:18 months;
Storage conditions: Cool and dry place (5ºC<T<30ºC); Relative humidity: RH<70%
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