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Mass processing capability

Sample&Prototype Processing capability

Layer(MAX)

2-18

20-30

Type of the board material

FR-4,high TG Board,aluminum
board rogers, etc.,F4,BT

FR4,high TG Board,aluminum
board Rogers,etc.,F4,BT

Compound pressed board

4layers--6layers

6layers--8layers

Maximum Size

610mm*1100mm

Outline size tolerance

+/- 0.13mm

+/- 0.10mm

Board Thickness range

0.3mm-6.00mm

0.20mm--8.00mm

Board Thickness tolerance

+/- 8%

+/- 5%

Board Thickness Range

+/- 10%

+/- 8%

Medium Thickness

0.076mm-6.00mm

0.076mm--0.100mm

Minimum line width

0.075mm

0.063mm

Minimum space Distance

0.075mm

0.063mm

Outer layer copper thickness

8.75um--175um

8.75um--280um

Inner Layer copper thickness

8.75um--175um

8.75um--220um

Drill hole size(power drill)

0.25mm--6mm

0.15mm--0.25mm

Hole size(power drill)

0.20mm--6mm

0.05mm--0.20mm

Hole size tolerance(power drill)

0.05mm

Hole position deviation
(power drill)

0.075mm

0.05mm

Laser hole size

0.10mm

0.075mm

Aspect Ratio

10:1

12:1

Solder mask type

Sensitive green,yellow.

Black,purple,blue,ink

Sensitive green,yellow.
Black,purple,blue,ink

Mininum width of solder
mask bridge

0.10mm

0.075mm

Minimum size of solder mask
Separation ring

0.05mm

0.025mm