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Bonded Fin Heat Sinks 

Bonded fin come in many different styles:

Mixed materials with aluminum fins and/or base
Epoxy bonded or solder attachment
Metal-to-metal swaged attachment

Advantages of Bonded Fin:

Uniform thickness fins
Mix of aluminum in base or fins
Equivalent extrusion ratios of > 50:1
Fins can be cut to size or other fabrication before attachment

The bonded fin heat sink uses a grooved base plate designed to attach flat fin in set fin pitch or position. Grooves in the base are sized to accept set thickness of fin and provide a high level of heat transfer from the base to the fins for dissipation to air. Good groove design and assembly adds very little added temperature rise to the overall heat sink performance. Some designs use extruded fins that are swaged or cold-formed in place by deforming the base material over the fins in their grooves.

Developed in the 1970s bonded fin originally gave engineers the advantage of eliminating the problem of extrusion ratio limitation. A bonded fin heat sink offered extrusion ratios of >50:1 and above at a time that extrusions could only achieve 10:1. This gave the additional cooling surface needed to cool early generation IGBT power modules and thermoelectric coolers when there were few alternatives.

Yinghua Electronic Co., Ltd. is a specialist designer and supplier of heat sinks for a diverse range of markets and applications. With 15 years experience in thermal management we are well equipped to find the most effective, reliable and economic solutions for your cooling needs. We have a team of skilled in-house engineers that work closely with our customers to develop highly optimized cooling solutions. We employ the latest mechanical and thermal modeling techniques to refine the cooling package to your application while always considering the key balance between performance, cost and time to market.
 

Our products:
Extruded Heat Sinks
Bonded Fin Heat Sinks 
Housing Heat Sinks 
Die Casting Heat Sinks 
Heat sinks For DC-DC Converters 
LED Cooling Solution