BGA221 SD Solution 11.5X13mm ic adapt eMCP eMMC Socket tester connector contact
Product Description
Item specifics
is_customized:
Yes
Brand Name:
SIREDA
Model Number:
702-0000178
Package:
BGA
Pitch:
0.5mm
Pin Count:
221
IC Size:
11.5X13mm
Structure:
Clamshell
Contact:
Spring Probe
Product Description
The SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices
The SD solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development.
- Test, debug, validation, and programming of eMMC, eMCP devices
- Failure analysis / System and wafer test
- Package and Chip qualification
- Production prototype / Data recover
- Suitable for devices of Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.
- Support eMMC version: ≤eMMC5.0.
- Support hot plug, eMMC can be directly connected to PC with SD card reader.
- Realize reading, accessing and writting data for eMMC and eMCP devices
|
|
Mechanical
Socket Body: PPS
Socket Lid: AL
Contact: Spring Probe
Operation Temperature: -40ºC to 140ºC
Life Span at Operating Travel:100K min.
Cycles Spring Force:27g per Pin
|
Electrical
Current Rating (Continuous) : 2.59A
Self Inductance:1.57nH
Bandwidth -1dB:10GHz
DC Resistance: 42mohm
|
|
- Place a Device by hand on to the socket.
- Lock the lid.
- Connect to PC by SD Card Reader.
- Now it is ready for use.
|
Product Image
Send Inquiry to this Member
Related Products of this Company
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content.
To report fraudulent or illegal content, please
click here.
China Suppliers Quick Searching:
,
