Model: | - |
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Brand: | Minder |
Origin: | - |
Category: | Industrial Supplies / Machinery / Welding Machinery |
Label: | ball bonder , ultrasonic bonder , gold wire bonder |
Price: |
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Min. Order: | 1 pc |
Live Chat: | Last Online:15 Mar, 2015 |
Features: |
Application LED, chips, diode, laser tube, the inner lead, MEMS,semiconductor devices etc. Specification 1,electric requiement:220VAC±10%、50HZ、be sure connected to ground 2,wire diameter:17~50μm 3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel 5,bond force:35-180g,two channel 6,digital camera systerm:optional 7,min bonding time:0.4s/wire 8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm 10,ball dimension:2-4 times bigger setable 11,bond temperature: house temperature ~ 400℃ 12,jig moving area: Φ25mm 13,microscope:15X,30X 14,dimension:700*460*550mm 15,weight:28kg |