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ultrasonic gold wire ball bonder 1
  • ultrasonic gold wire ball bonder 1

ultrasonic gold wire ball bonder

Model:-
Brand:Minder
Origin:-
Category:Industrial Supplies / Machinery / Welding Machinery
Label:ball bonder , ultrasonic bonder , gold wire bonder
Price: -
Min. Order:1 pc
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Member Information

Detail

Guangzhou Minder-Hightech Co.,Ltd

Free MemberGuang Dong - China
Live Chat:Last Online:15 Mar, 2015

Product Description

Features:

Application

LED, chips, diode, laser tube, the inner lead, MEMS,semiconductor devices etc.

Specification

1,electric requiement220VAC±10%、50HZbe sure connected to ground

   2,wire diameter1750μm

   3,ultrasonic power03W, two channel. can be set separately of the two point

   4,bond time0200mstwo channel

   5,bond force:35180gtwo channel

   6,digital camera systermoptional

   7,min bonding time:0.4s/wire

   8,span between first bond to second bond by automatic mode: more than 4mm.

   9,length of terminal wire: 0-2mm

   10,ball dimension2-4 times bigger setable

   11,bond temperature:  house temperature ~ 400

   12,jig moving area: Φ25mm

   13,microscope:15X,30X

   14,dimension:700*460*550mm

   15,weight:28kg


Product Image

ultrasonic gold wire ball bonder 1
Img 1

Send Inquiry to this Member

Guangzhou Minder-Hightech Co.,Ltd

Room 1202, GuiGuan Building, No 801,JieFang North Road,YueXiu District,Guangzhou,China

Phone:
86-20-87074897
Fax:
86
Contact:
Hu (engineer)
Mobile:
18588781578
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