Hot Bar Bonding and Soldering
Product Description
Fucun's Hot Bar Bonding & Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB.
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- Microprocessor-based controller provides precise and consistent temperature control.
- Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down.
- Flexible programmable profiles for targeted idle, preheat and reflow temperature.
- Floating thermode and digital pressure control.
- Manual shuttle of work; optional pneumatic shuttle.
- NEW: Bonder machine uses conductive adhesive film (ACF) for very fine pitch devices. Click here for larger image.
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