Contactless Card Chip Bonding Machine YCB-18
Product Description
The machine is designed for bonding or welding the contactless card antennas and chips together in an automatic and speedy way.
- In order to ensure its reliability, the key components such as PLC, touch screen and servo system from Mitsubishi are applied inside.
- The lead screw by German REXROTH is applied to ensure precise motion precision.
- The bonding unit is dual-pulse high-frequency inverting welding system to ensure fast and quality welding, and the instant current output or instant voltage output can be freely selected.
- The bonding is fast in speed and good in quality.
- Speed: 3500 units per hour
- Bonding head number:8
- Motion precision: 0.0125mm
- Mechanical adjustment: 0.01mm
- Compressed air: 6 kg/cm2
- Air Consumption: 80 L/min.
- Power:18KW
- Power supply: AC220V 50/60HZ 100A
- Weight: 1000 KG
- Dimension: L1300×W900×H1700mm
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