High-precision 8 Layers BGA PCB with Immersion Gold, ENIG Surface Finish
Product Description
|
Base material: FR4
Layer count: 8
Board thickness: 1.6mm
Copper thickness: 1oz
Surface finishing: ENIG
Soldermask color: green
Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30° (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI): dimension
Electrically test: supported
Compliant with RoHS Directive
Possibility of SMT device mounting: supported
|
 |
Product Image
Send Inquiry to this Member
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content.
To report fraudulent or illegal content, please
click here.
China Suppliers Quick Searching:
,
