Product Description
Application：
Combined with Liquid Epoxy Resin, suitable for Epoxy embedding material, Casting
material,Encapsulating material, Coating Material, and Adhesive. To be used in
non-solvent unticorrosion coating, widing-forming.
Application features: Low viscosity, can greatly lower the viscosity of epoxy resin, improve
the tenacity and adhesion of cured epoxy resin, good solubility with various epoxy resins.
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