Product Description
- Layer count: four
- Base material: FR4 (Tg150)
- Copper thickness: 1oz
- Minimum hole size: 0.3mm
- Minimum line width/space: 0.35mm
- Solder mask: glossy green/10 to 30um
- Blind buried holes: supported
- Controlled impedance: supported
- Surface treatment: immersion gold
- Finished board thickness: 1.6mm
- Panel array: five pieces in one panel
- Profile: CNC routing and v-cut
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