Division I board production capacity is as follows 1, surface treatment: spray tin, lead-free tin, nickel / gold, chemical nickel / gold, OSP film.

In 2, PCB Layer 1-8 layer layer In 3, the largest processing area of single / double 600mmx450mm 4, thickness of 0.3mm-3.2mm minimum Xian Kuan 0.10mm minimum line spacing 0.10mm 5, minimum finished hole 0.2mm In 6, the minimum pad diameter of 0.6mm 7, metallized hole diameter tolerance ≤ Ф 0.8 ± 0.05mm, 0.8 ± 0.10mm Ф In 8, hole deviation ± 0.05mm 9, insulation resistance > 1014 Ω (normal) In 10, hole resistivity ≤ 300u Ω In 11, the dielectric strength ≥ 1.6Kv/mm In 12, peel strength of 1.5v/mm 13, solder resist hardness > 5H 14, heat shock at 288 ℃ 10sec In 15, grade 94V-0 combustion 16, 235 ℃ 3S, solderability wetting warpage T < 0.01mm/mm Ionic Cleanliness < 1.56 μ g /cm2 17, base copper thickness: 1/2oz, 1oz, 2oz In 18, the coating thickness: typically 25 microns, also can be up to 36 microns In 19, the guest for the data the way: GERBER files POWERPCB files, PROTEL files, PADS2007 files AUTOCAD files, PcbDoc files, such as model Characteristics: a model for small batch fastest 24 hours of delivery within 50 square metres 3-5 days can be expedited shipment