Specifications:

1. Total power: 3000 W

2. Top heater: 800 W

3. Bottom heater: 2000 W

4. Power supply: single-phase 220 VAC 50/60Hz 3KVA

5. Machine Dimension: 450 × 380 × 580mm

6. Temperature control: high-precision K Sensor

7. Positioning: V-groove for PCB positioning, Max PCB size: 300 × 320mm

8. Weight: About 25 kg

Features:

1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.

2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.

3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.

4. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.

5. Top & bottom heating can be controlled independently by the temperature graphs.A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.
7.the machine support all computer motherboard,laptop motherboard, display card,mobile phone etc.