Model: HSFP 1. Working Temperature -55 – 125 ℃ 2. Shrinking temperature range 110 ℃ for 1 minute, and allow an FLCOditional 30 seconds cooling down time before inserting the splice into a tray to allow the meltable FLCOhesive to set. 3. Technical Data Properties Test Method Typical Data Tensile Strength(MPa) ASTM D 2671 18 Ultimate Elongation (%) ASTM D 2671 700 Density (g/cm2) ISO R1183D 0.94 Dielectric Strength (KV/mm) IEC 243 20 Dielectric Constant IEC 243 2.5 Longitudinal Change (%) ASTM D 2671 +3
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content. To report fraudulent or illegal content, please click here.