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X-23-7783D is a thermal interface material developed by Shin-Etsu Chemical Co.,Ltd to meet the current and future thermal management requirements of high performance microprocessors. It is used to increase heat sink effectiveness by closing the air gap existing between the top of the processor and the fan heat sink. Air is a thermal insulator with a thermal conductivity of 0.027W/mK.
The thermal interface material is applied to the raised area on the top of the processor after the processor is on the socket. The fan heat sink is centered on the processor top,with the raise area on the bottom of the heat sink and the processor top aligned. The fan heat sink is firmly pressed to evenly distribute the thermal interface material until the metal of the heat sink is felt against the metal of the processor top. The excess thermal interface material can be removed by wiping with a soft cloth.
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Typical properties
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Appearance
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Gray Paste
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Viscosity at 25〬C (P)
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1500
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Bleed after 24hrs. at 150〬C (%)
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<0.1
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Volatile content after 24hrs. at 150〬C (%)
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2.5
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Thermal conductivity (W/mK)
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>4(with solvent)
>6(without solvent,as X-23-7783)
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Handing instruction:
1. Suggest to store the material under 10 degree C. Once open the lid,please use it up as soon as possible.
2. Require stirring the material up before using.
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