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Category: single-sided, double-sided, multi-layer
Laminate type: FR-2, CEM-1, CEM-3, FR-4
Copper thickness: 0.5OZ-5OZ
Circuit formation: dry film, photo imageable ink, silk-screen
Solder mask: photo imageable ink, oven-cured ink, UV ink, peelable, mask ink
Legend marking: oven-cured ink, Uvink
Conductive paste: carbon paste, silver paste
Surface treatment: Hot air leveling, electro-nickel, electro-nickel/gold, electroless nickel/gold, Entek, preflux
Outline formation: CNC routing, die punching, V-CUT, beveling
Circuit test: computerized circuit test(10V-300V,insulation resistance 1-40MΩ)
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