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Tantalum sputtering targets (Ta target, tantalum sputter target) 
Grade :  3N, 3N5, 4N, 4N5 with Ta 99.95%min
Chemical composition   :
                Ta                  99.95   %min
                O                   0.0100  %max
                C                   0.0040  %max
                N                   0.0040  %max
                H                   0.0010  %max
                S                    0.0001  %max
                Al                   0.0005  %max
                Ca                  0.0005  %max
                Cd                  0.0005  %max
                Cl                   0.0005  %max
                Co                  0.0005  %max
                Cr                   0.0005  %max
                Cu                  0.0005  %max
                Fe                  0.0005  %max
                Hf                  0.0005  %max
                K                   0.0001  %max
                Li                   0.0001  %max
                Mg                  0.0005  %max
                Mn                  0.0005  %max
                Mo                  0.0050  %max
                Na                  0.0001  %max
                Nb                  0.0400  %max
                Ni                   0.0005  %max
                Pb                  0.0005  %max
                Si                   0.0005  %max
                Sn                  0.0005  %max
                Ti                   0.0005  %max
                Th                  0.0050  %max
                V                    0.0005  %max
                W                   0.0150   %max
                Zn                  0.0005  %max
                Zr                   0.0005  %max
                Y                    0.0005  %max
                U                    0.0050  %max
                Others (each) : 0.0005  %max
Total metallic elements :   0.05%max

Recrystallization           :   95%min
Grain size    :  ASTM 4 or finer
Surface finish: 32Rms max. or Ra 0.4 ( RMS64 or better)
Flatness       : 0.1mm or 0.15% max.
Tolerance     : +/-0.010" on all dimensions

Dimensions :
For Tantalum target (flat targets, rectangular target): 
1mm up to 12.7mm Thickness x Width up to 600mm x Length up to 1800mm (.04” – 0.50” thick x width up to 23.62” x length up to 70”);

For Tantalum targets (circular target):
25mm up to 650mm Diameter x 3mm up to 25.4mm Thickness (1” – 25” diameter x 0.1181” – 1” thickness)

The material is available as follows :
- R05200, unalloyed tantalum, electron-beam furnace or vacuum-arc melt, or both,
- R05400, unalloyed tantalum, powder-metallurgy consolidation,
- R05255, tantalum alloy, 90 % tantalum, 10 % tungsten,

  electron-beam furnace of vacuum-arc melt, or both,
- R05252, tantalum alloy, 97.5 % tantalum, 2.5 % tungsten,
  electron-beam furnace or vacuum-arc melt, or both, and
- R05240, tantalum alloy, 60 % tantalum, 40 % nobium,
  electron-beam furnace or vacuum-arc melt.

The popular geometries of tantalum sputtering target are available with both planar sputtering targets and rotatable sputtering targets, such as tantalum circular, tantalum rectangular, tantalum ring, tantalum tube, tantalum cylinder(cylindrical targets) and tantalum conicity, etc.,  we can meet your unique requirements on tantalum sputtering targets no matter in density, purity, homogeneity or in geometry of the sputtering target for the thin film industry.

Trade names :  Ta target, Ta sputtering targets, Ta targets, Ta sputtering target, Sputtering target of Ta, Flat target of tantalum,  tantalum target, tantalum targets, tantalum alloy targets, tantalum tungsten alloy targets, tantalum sputtering targets, tantalum sputtering target, tantalum sputter target, tantalum sputter targets, tantalum thin film,