Base Material : Paper + PET
Adhesive : Silicone
Thickness : 0.25 mm
Adhesion : 1,500 gf/in
Feature : Heat resistant = 180 degC. Chemical resistant. Remove without leaving residue.
Application : Protect specific area of PCB for hot air levelling process.
Base Material : Crepe paper
Adhesive : Acrylic
Thickness : 0.14 mm
Adhesion : 300 gf/in
Feature : High temperature performance. Easy peel off after masking.
Application : For wave solder masking of printed circuit board.
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content. To report fraudulent or illegal content, please click here.