| 1)Applied in semiconductor wafer’s cleaning and etching; 2)Standard etching process,use HF/HNO3, KOH, NaOH, H3PO4, BOE, DHF, SPM, SOM and etc. 3)Control mode: Manual,semi-auto,Auto.; 4)Material:Depending on process and customer requirement,available matierials eg.PP,PVC,PVDF,Quartz Tube,Stainless steel and others; Features and benefits: A. Module design;Depending on customer requriment and process,offer special solution; B. Customization based on customer budget; C. Optimum wet cleaning solution; D. High PPR; E.Various options available:; F. Operator friendly and safe; G. Easy maintenance; Non-standard product,please contact for special process solution with your requirement! For more product infos, please download: CSE Semiconductor Product Catalogue. |