AIM 锡膏 SAC305 Sn100C, Sn/Bi 
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AIM SAC305, N100C, Sn42/Bi58 无铅锡膏,锡丝 及各种特殊规格焊锡
Underfill, Adhesive 黏著胶
270WR VOC free 助焊剂
| 产品规格︰ | AIM网站
NC257:USA SMT 2008 award vision winner
underfill 620(CSP用充填胶):special for SCP usage New winner
http://www.aimsolder.com/press_room_view.cfm?newsid=49
美国SMT学会得奖
*各种成份之锡膏:63/37,62/36/2,96/4,43/43/14---.
*无铅焊锡:
CASTIN(AIM拥有之专利):96.2%Tin(锡),2.5%Silver(银),
0.8%copper(铜),0.5%antimony(锑).
SAC305:96.5%Tin(锡),3%Silver(银),0.5%copper(铜).
Advantages
*Pin Probe testable residue(2 min. to 2 months).low process residue.
*reduce void on Micro BGA.
*high speed without slumping.
*high humidity & slump tolerance
*no clean,aqueous clean are acceptable.
*passing both SIR and Electromigration testing.
*on hard to-solder-materials, including bare copper and Alloy 42.
Features
*mildly activated resin-base formula.
*meet variety alloys(Lead Free included).
excellent wetting.extended idle time,tack time,stencil life.
*air reflow & nitrogen acceptable.
*pass Bellcore,IPC reliability test.
Easily pin probe tested
High heat and humidity resistance
Suitable for high-speed printing
Residues safe to be left uncleaned on RF devices up to 50 gigahertz
Eliminate solder defects such as voiding and solder beading |
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图 1
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